Chicago, IllinoisOpen to RemoteDirect Hire$160k - $180kA rapidly growing consumer hardware and AI company is seeking a Senior Firmware Engineer, Connectivity, to join their full-time engineering team. This role can be based in the United States and focuses on building next-generation connected devices that blend embedded systems, cloud technology, and machine learning. The ideal candidate will bring deep expertise in Bluetooth Low Energy (BLE), embedded development in C/C++, and wireless device architecture while helping scale a globally deployed product platform. This is a unique opportunity to become the primary technical owner of wireless connectivity for a category-defining consumer product. The engineer joining this team will influence architecture decisions, firmware update strategy, power optimization efforts, manufacturing validation, and customer-facing reliability initiatives. Candidates who enjoy solving difficult challenges across firmware, RF, hardware, and mobile environments will find significant growth opportunities and ownership in this position.Required Skills & Experience· 5+ years of embedded software or firmware engineering experience 3+ years building and shipping BLE-enabled products Strong understanding of Bluetooth protocols including GAP, GATT, L2CAP, SMP, and BLE security Expertise with C and/or C++ development on microcontrollers Experience with embedded peripherals including UART, SPI, I2C, and DMA Hands-on debugging experience using oscilloscopes, logic analyzers, and protocol sniffers Experience deploying OTA firmware updates in production environments Knowledge of low-power device optimization techniques Desired Skills & ExperienceNordic Semiconductor platform experience Zephyr or nRF Connect SDK experience Consumer electronics or IoT product experience Secure boot and embedded security knowledge Regulatory certification experience (FCC, CE, Bluetooth SIG) Manufacturing support experience Python or Node.js tooling experience Multi-device BLE architecture expertise What You Will Be Doing Tech Breakdown 70% Embedded Firmware Development 20% Wireless Connectivity & RF Optimization 10% Automation, Tooling & Testing Daily Responsibilities 80% Hands-On Engineering 5% Leadership & Mentorship 15% Cross-Functional Collaboration The OfferBonus eligible You will receive the following benefits: Medical, Dental, and Vision Insurance Vacation Time Stock Options Applicants must be currently authorized to work in the US on a full-time basis now and in the future.
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